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The next fairs:
Date: 20th - 22nd May
EASTEC, Springfield (Massachussetts)
Date: 27-31 May 2008
XYLEXPO, Milan - Rho (Italy)
Date: 3rd-5th June 2008
ATX, New York (New York City)
Date: 5th & 6th June 2008
MECFORPACK BOLOGNA 2008, Bologna (Italy)
Image & Communication
COLOMBO FILIPPETTI spa, is always attentive to the diffusion of its company image.

The main communication instruments are the participation in business sector fairs in Europe, America and Asia, and the diffusion of news through a Press Overview.